Multek, a Guangdong, China-based technology company is one of the companies exhibiting at the WT | Wearable Technologies Conference in San Francisco. The company will showcase its printed circuit board technologies at the event.
Multek offers a range of PCB engineering and manufacturing expertise for the medical device and wearables industries. Its capabilities include high density interconnect, rigid, flexible and rigid-flex printed circuit and assembly solutions.
Leadership in complex multi-layer PCB processing has been a core Multek competency for over fifteen years. The company invests continuously in innovation, capital equipment, and engineering expertise to enhance its technology capacity and capability, from early prototypes and New Product Introduction (NPI) to mass production scale.
Multek’s rigid PCB mass production capabilities include: stacked, blind and buried microvia technologies applied in High Density Interconnect (HDI), and high layer count, using high-speed/low-loss capability materials for increasing product and sub-system requirements that span across all major consumer, telecom, commercial, and industrial market segments, according to the company.
Multek’s product solution encompasses Wearables, Telecommunication, Computing, Mobile, Consumer electronics, Energy, Healthcare, Automotive, Aerospace-Defense, and more.
Telecommunications, networking, and data communications equipment makers are constantly under pressure to constantly innovate, lower costs, and improve speed-to-market. Multek helps you achieve these goals through low-cost, high-volume manufacturing capabilities that can support even the most complex 4G, 5G, optical, thermal management, exotic high-speed materials, and signal integrity requirements.
High-reliability is a top priority in the Medical field. Multek provides the best printed circuit boards (PCBs) and flexible circuits for a complete range of products, from simple consumer disposables, to high-end lab or hospital equipment, and new areas like wearables.