Flexible hybrid electronics (FHE) is an innovative technology that combines the performance of semiconductor devices with the flexibility and low cost of printed plastic film substrates. FHE allows manufacturers to develop a new category of electronics, such as sensors that are lighter in weight, conform to the curves of a human body or stretch across the shape of an object or structure – all while preserving the full operational integrity of traditional electronic architectures.
The FHE market was valued at USD 82 million in 2018 and is expected to reach USD 198.9 million by 2024, registering a CAGR of 16.2% over the forecast period of (2019-2024). Automotive, electronics, the Internet of Things (IoT), wearables, and other emerging chip markets are expected to provide growth opportunities for flexible hybrid electronics market, which often share manufacturing processes and materials with semiconductors, according to ReportLinker.
In 2019, Nextflex had 90 corporate members and 28 Educational Institutes. Nextflex facilitated about 62 million of investments from 2015 to 2019, making it the biggest agency to invest in this technology.
FHE is making a significant impact in various markets, with the automotive sector providing substantial opportunities. Whether it is sensors, OLED displays, and lighting, in-mold electronics, printed heaters or other applications, hence the market is expected to witness massive opportunities for flexible electronics in the automotive industry.
Asia is emerging as a vital and essential region for the development of FHE, particularly in the manufacturing of advanced semiconductor products. Most countries in Asia have a steady growth of the market, in particular, ones in East Asia (China, Japan, Taiwan, South Korea, Singapore).
Asia-pacific region has the most advanced and proficient technical approach to design and manufacture devices for fast-growing markets including IoT, environmental sensing, wearable applications, flexible displays, and others.